44 zł
Description
- Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened..
- Thermal conductivity:> 1.2W/m-K.
- Strength of connected buildings: 55 lb..
- Features: thermal properties, strong adhesion.
- Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsinkï VGA CARD Northbridge Southbridge Heatsink..
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10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink
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